Wii Like Chipshots!

February 19th, 2008

I love looking inside chips, and Flylogic takes some of the sweetest chip shots. bushing sent me some Wii chips to play with a few weeks ago, and Chris at Flylogic expertly decap’d and imaged them for me. I thought they were pretty neat, so here’s a couple of them to share with you:

The chip above is the Macronix mask ROM part inside the Wii. It also has some SRAM and a real time clock on-die. The large block on the left is the mask ROM, and the smaller block on the right is the SRAM. The top right has a fairly regular arrays of flip-flop like logic structures, so those are probably command or address registers for the chip.

The chip above is the serial EEPROM chip that’s flip-mounted onto the Hollywood package. The Hollywood GPU on the Wii actually consists of three silicon chips on a single substrate, as the image below shows. The serial EEPROM is indicated by the pink arrow.

The bond pads still have the flip-mounting bumps on them, so they show up as large black circles in the photo. Flylogic later removed the bumps using a neat hack with their wirebonder, and then rebonded the die into an 8-pin DIP so the contents could be read out with a conventional ROM burner. I found it particularly enlightening to see the ratio of logic versus the size of the actual memory array for the serial EEPROM (the memory array is the regular set of cells in the top-right corner). Essentially, at this capacity scale (2048 bits), you’re paying for a bunch of logic, and not much memory. Doubling the memory capacity would minimally impact the overall die size, since most of what’s on there looks to be flip flops for shift registers and command latches.

Name that Ware January 2008

February 8th, 2008

The ware for January 2008 is shown below. Click on the image for a much larger version.

This photograph isn’t of the whole unit, it’s just of one (important) part of it; but I think that’s part of the challenge. I believe there are enough hints buried in the photograph for one to deduce exactly what product this comes from.

This month, I will again be able to offer a dent-and-scratch chumby as a prize. Have fun!

Winner of Name that Ware December 2007!

February 8th, 2008

The ware from December 2007 was a Philips AJL308 “Clock Radio”.

It’s a nice past-time of mine to go to the local retail store, buy something off the shelf that looks relevant to my area of interest, and take it apart. I did a little tear-down writeup which I share as a link with anyone who cares to read it; it’s a lot of words and images for a blog post. These days, an alarm clock radio with a graphic LCD screen is interesting from my perspective and I can learn a thing or two from the design choices made by Philips in creating a product like this. I saw it on the shelf at Meijer’s while I was doing my last-minute Christmas shopping, so I got one, took it home and plucked it apart. Yes, this is what I do when I go home for Christmas; then again, it didn’t phase my parents at all to see alarm clock guts all over the dining room table. It’s just what curious kids do, right?

As for the winner, it’s super-hard to pick a winner this time; so many thoughtful posts. I think I’ll have to go with Dave Z this time — he did get the answer exactly right; if it wasn’t for his third post talking a bit more about his analysis and methods for arriving at it, he would have been beaten out by some of the other quality posts that didn’t quite arrive at the right answer but had great insight. Congratulations, contact me for your prize!

Xbox360 RROD (Again)

January 21st, 2008

Nate just linked me to this post interviewing an inside source in Microsoft about the causes of the RROD. Now that I’m involved in hardware manufacturing of consumer devices, it’s a fascinating case study of what not to do, so I’m paying attention and taking notes.

A while back I posted that I was looking for an RROD Xbox360; I actually sent it off to MEFAS to get digested for solder joint inspection on the GPU through a process called “dye and pry”. In this process, the motherboard is flooded with red ink, and then the GPU is mechanically pried off the board. The red ink flows into any of the tiny cracks in the solder balls, and at least in theory, when you pry the GPU off the cracked regions will shear first so you will be left with visible red spots at the points of failure.

The findings were interesting. Below is what a normal ball looks like after the test:

(click on the image for a larger version)

And here is one of several balls on the GPU that exhibited signs of partial failure:

There was also some “voiding” seen in the balls, e.g. trapped gas bubbles inside the solder balls that might serve as starting points for mechanical failure. Some voiding is expected, and there’s not a lot of data I can find correlating failure with voiding, but I could imagine in a stressful mechanical environment these things don’t help.

I was a bit puzzled by these results because you didn’t see any “catastrophic” failure — pools of red ink over a connection interface — just partial cracking. Partial cracking isn’t terribly uncommon, and many products work quite well despite such artifacts. However, after reading the article linked above, if Microsoft shorted safety margins around many of the design parameters to get the product out on time, it makes sense that the summation of many partial failures could lead to a total system failure — failures that have symptoms that vaguely cluster together but are difficult to point to any single root cause. Heisenbugs. Yuck.

Complex systems are a bitch to get right — and reliable. I think about that every time I step onto an airplane, or when I read about the space program. Respect to the engineers at Boeing and NASA!

CES08 Faves

January 8th, 2008

I saw a couple of things at CES this year that I actually thought were worthy of sharing. Usually it’s just faster, shinier, bigger, badder gadget after gadget — yawn. I’m pretty jaded, you could say, when it comes to gadgets. I still carry around and cherish my aging Blackberry, and despite the nasty inch-long crack in the front bezel everything works great. It’s almost a badge of honor–no iPhone could handle that kind of real-world abuse and keep on serving its owner so faithfully.

The most stunning thing I saw at CES this year was no gadget, however. It was a mock-up of the “motherglass” substrate that Sharp uses to make its 57″ LCD panels.

That is indeed the mother of all glass substrates.

There’s these huge frickin machines somewhere out there in this world that takes in that 9 foot piece of glass and deposits thin films of silicon on it, and images microscopic patterns into the films to make all those big, beautiful hi def LCD displays that the gadget freaks lust after. I lust after the machine that makes those panels–eight 57″ LCDs panels at a time. It makes those 12″ wafers at the Intel booth look well…small.

Other noteworthy things were the 128 gigabyte 2.5″ solid state flash drive for laptops that Toshiba had on display at their booth. I think there was another vendor that offered drives like this–Sasmung I think? But they didn’t have the circuit boards out for me to gawk at like Toshiba did.

Click on the image for a larger version of the circuit board. The drives are currently priced at $10/gigabyte, but hey, you know, Moore’s law will fix that eventually (although eventually is getting pushed out farther and farther as Moore’s law slows down). These drives are much faster than a standard hard drive for random seek, so it makes things like rebooting your laptop happen in half the time. Personally, I’d love to see this technology combined with a couple gigabytes of embedded DRAM and a smart caching chip to make one wicked fast mass storage device.

The other thing I saw that was neat is a Menlow-based motherboard, the first I had seen. I uhh…forgot what product it was in, it’s some Toshiba ultra mobile PC, but who cares about that; I’m sure engadget has some article on it if you’re into those kinds of things. The motherboard was the interesting part for me.


Click on the image for a larger version of the motherboard.

That’s it for now — I only got through about a third of the exhibits there so far, I had a lot of meetings for the past couple of days. If I find anything else really interesting tomorrow I’ll post it!