The Ware for December 2015 is shown below.
This ware got me at “6502”. Thanks to DavidG Cape Town for contributing this specimen!
One question for the readers (separate from naming the ware!), it’s been something I’ve wondered about for decades. On the back side of this board, one can see ripples on the fatter traces. My original assumption is this is due to a problem with hot air leveling after the application of a solder finish to the bare copper board, before the soldermask is applied. However, the top side is almost entirely smooth, so clearly the process can supply a flatter finish.
So here’s my quandary: are the ripples intentional (for example, an attempt to increase current capacity by selectively thickening fat traces with a solder coating), or accidental (perhaps microscopic flaws in the soldermask allowing molten metal to seep under the soldermask during wave soldering)?
Been wondering about this since I was like 15 years old, but never got around to asking anyone…
Happy holidays to everyone! I’ll be at 32C3 (thankfully I have a ticket), haunting the fail0verflow table. Come enjoy a beer with me, I’m not (officially) giving any talks so I can actually sit back and enjoy the congress this year.