Releasing free PDF of “Hacking the Xbox” in honor of Aaron Swartz

March 11th, 2013

No Starch Press and I have decided to release a free ebook version of Hacking the Xbox in honor of Aaron Swartz. As you read my book, I hope that you’ll be reminded of how important freedom is to the hacking community and that you’ll be inclined to support the causes that Aaron believed in.

Apologies in advance if there are any hiccups in the distribution of the free copy. The primary host is a server in my flat, which only has a 100Mbps up-link (currently pushing >30Mbps one hour after posting).

Open Source Geiger Counter Update

March 11th, 2013

Today, March 11, marks the second anniversary of the Tohoku-Oki earthquake that devastated Japan and triggered the meltdown of Fukushima Daiichi. In a desire to help any way I could, I joined Safecast and created an open source Geiger counter reference design, which I released last year around this time.

Since then, Safecast launched a successful Kickstarter campaign, and International Medcom has completed the monumental tasks of tooling, testing, debugging, and developing firmware for this little device.


Above: the limited edition Kickstarter version of the Geiger counter in action.


Above: the steel tools used to injection mold the ventral case of the Geiger counter.

Finally, the clear, limited-edition Kickstarter devices are shipping. You can see some photos of them on the Make Blog as Eric Weinhoffer at Make is helping to put the finishing touch on every unit: a laser-cut, limited edition serial number on the back of each case.

Having shipped many products myself, I know how hard everyone has worked to make this a reality. Congrats guys!

If you donate to Safecast between now and 11:59 PM EDT tomorrow, March 11th, Global Giving will match your donation 200%. As long as funding remains, they’ll even match your donation 100% until March 15th. Click the image below to learn more and contribute to a great project.

Name that Ware March 2013

March 11th, 2013

The Ware for March 2013 is shown below. Click on the image for a larger version.

Thanks to Patricio Worthalter for contributing this month’s ware! The PCI Matchmaker from AMCC brings me back. I used one of those as part of my Master’s thesis, back in the day when FPGAs accessible by mere mortals couldn’t do PCI directly. Man, it was (and still is) a pain to properly obtain the official PCI bus specs…PCI is a member’s-only club, with a $3k annual fee. Ain’t nobody got dime fo’ that!

Winner, Name that Ware February 2013

March 11th, 2013

The Ware for February 2013 is the Worldsemi WS2812. It’s a digital-to-light converter — add +5V, ground, and shift in a digital code word, and out comes PWM RGB light. The chip also features a digital output for cascading multiple LEDs in a row. It’s an extremely versatile chip that was brought to my attention by Dave Cranor during the Shenzhen geek tour in January — one of those things that you just keep a stock of at all times because it’s a dirt simple way to add a beautiful-looking LED into a tight spot. You can buy ones mounted on a little PCB from Adafruit.

I’ll give Randy the prize this month, since he was the first to correctly identify the entire packaged ware, and also gave a link to a datasheet (which I had also been looking for). Thanks, and email me for your prize!

Where USB Memory Sticks are Born

February 12th, 2013

In January, I had the fortune of being a keynote speaker at LCA2013. One of the tchotchkes I received from the conference organizers was a little USB memory stick.

I thought it was a neat coincidence that I was in a factory that manufactured exactly such memory sticks about a week before the conference. In fact, I managed to score a rare treat: the factory owner gave me a sheet of raw chip-on-flex, prior to bonding and encapsulation, to take home.

The USB sticks start life as bare FLASH memory chips. Prior to mounting on PCBs, the chips are screened for capacity and functionality. Below is a photo of the workstation where this happens:

In the image, you can see stacks of bare-die FLASH chips, awaiting screening with a probe card. I love the analog current meter and the use of rubber bands to hold it all together. The probe card has tiny needles on it that touch down on microscopic (less than 100-micron square) contacts on the chip surfaces. Below is what a probe card looks like.

Below is an image through the microscope on the micro-probing station, showing the needles touching down on the square pads at the edge of the FLASH chip’s surface.

Interestingly, this all happens in an absolutely non-clean-room environment. Workers are pretty much handling chips with tweezers and hand suction vises, and mounting the devices into these jigs by hand.

Once the chips are screened for functionality, they are placed by hand onto a PCB. This is not an unusual practice, pretty much every value-oriented wirebonding facility I’ve visited relies on the manual placement of bare die. The photo below shows a controller IC being placed on a panel of PCBs. The bare die are in the right hand side of the photo, sitting in the beige colored waffle pack.

The lady is using some sort of tool made out of hand-cut bamboo. I still haven’t figured out exactly how they work, but every time I’ve seen this process they are using what looks like a modified chopstick to place the chips on the board. My best guess is that the bamboo sticks have just the right surface energy to adhere to the silicon die, such that silicon will stick to the tip of the bamboo rod. A dot of glue is pre-applied to the bare boards, so when the operator touches the die down onto the glue, the surface tension of the glue pulls the die off of the bamboo stick.

It’s trippy to think that the chips inside my USB stick were handled using modified chopsticks.

The chips are then wirebonded to the board using an automated bonding machine which uses image recognition to find the location of the bond pads (this is part of the reason they can get away with manual die placement).

(view in HD)

The first half of the video above starts out with the operator pulling off and replacing a mis-bonded wire by hand, and re-feeding the wire into the machine. Given that these wires are thinner than a strand of hair, and that the bonding pads are microscopic, this is no mean feat of manual dexterity.

Here’s a scan of the partially-bonded but fully die-mounted PCB that I was given as a memoir from my visit (I had since crushed some of the wire bonds). The panel contains eight USB sticks, each consisting of a FLASH memory chip and a controller IC that handles the bridging between USB and raw FLASH, a non-trivial task that includes managing bad block maps and error-correction, among other things. The controller is probably an 8051-class CPU running at a few dozen MHz.

Once the panels are bonded and tested, they are overmolded with epoxy, and then cut into individual pieces, ready for sale.

Interestingly, the entire assembly prior to encapsulation is flexible. The silicon chips have been thinned down by grinding off their back sides to the point where they can tolerate a small amount of flexing, and the PCB is also so thin, it is flexible.

For those of you interested in this kind of thing, here’s the die marking from the FLASH chip; apparently it is made by Intel:

Here is also a die shot of the controller chip:

And now you know where those tiny USB thumb drives are born.

Thanks to David Cranor for contributing images. Images used with permission.

PS: chopsticks